Machining Damage, n, (MD^S) - as used in fractography, surface microcracks or chips created during the machining process, i.e., striations, scratches, impact cracks.

NOTE - Machining may result in surface and/or subsurface cracks.
NOTE - The codes in parenthesis after each term are provided for use in statistical analysis. A superscript "S" stands for inherently surface- distributed origins.

Handling Damage, n, (HD^S) - as used in fractography, scratches, chips, cracks, etc., due to the handling of the specimen.

Pit, n, (PT^S) - as used in fractography, a cavity created on the specimen/component surface during the reaction/interaction between the material and the environment, e.g., corrosion, oxidation.

Surface Void, n, (SV^S) - as used in fractography, a cavity created at the surface/exterior as a consequence of the reaction/interaction between the material and the processing environment, i.e., surface reaction layer or a bubble that is trapped during processing.